维普期刊资源整合服务平台（V6.5）

3653篇 您的检索式：期刊名="Packaging "

选中清除导出查看参考文献查看引证文献引用追踪共183页首页上一页第1页下一页末页 /183 跳转

	题名	作者	年代	出处	被引量
1	Magnetically ordered ferroelectric materials显示文摘	SKINNER S M	1970	IEEE Trans Parts Mater Packaging1970，6，：	2
2	Drop on Demand Solder Droplet Jetting System for Fabricating Microstructure显示文摘	LEE T M KANG T G YANG J S	2008	Electronics Packaging Manufacturing2008，31，3：	1
3	Printed circuit board recycling: A state-of-the-art survey显示文摘	JIANGZHI L SHRIVASTAVA P ZONG G	2004	Electronics Packaging Manufacturing IEEE Transactions2004，27，1：	1
4	Errors associated with the design,calibration and application of piezoresistive stress sensors in(100)silicon 显示文摘		1994	IEEE Trans Components Packaging Manufacturing Technol1994，，：	1
5	Electrical conduction models for isotropically conductive adhesive joints显示文摘	MORRIS J E	1997	IEEE Transactions on Components Package Manufacturing Technology1997，20，1：	1
6	Isothermal and thermal cycling aging on IMC growth rate in lead-free and lead-based solder Interface显示文摘	XU L H PANG J H L PRAKASH K H	2005	IEEE Transactions on Components and Packaging Technology2005，28，3：	1
7	Multi-Objective placement of electronic components using evolutionary algorithms显示文摘	DEB K JAIN P GUPTA N	2004	IEEE Transactions on Components and Packaging Technologies2004，27，3：	1
8	ESD Phenomena in GMR Heads in the Manufacturing Process of HDD and GMR Heads显示文摘	Matsugi Junya Mizoh Yoshiaki Nakano Taro	2005	IEEE Transaction on Electronics Packaging Manufacturing2005，28，3：	1
9	Modeling of simultaneous switching noise in high speed systems显示文摘	Chun S Swaminathan M	2001	IEEE Transactions on Advanced Packaging2001，24，2：	1
10	Frequency-dependent crosstalk simulation for on-chip interconnections 显示文摘	Deutsch A Smith H H	1999	IEEE Trans Advanced Packaging1999，22，3：	1
11	Rough Set Theory:a Data Mining Tool for Semiconductor Manufacturing显示文摘	Andrew Kusiak	2001	IEEE Transactions on Electronics Packaging Manufacturing2001，24，1：	1
12	Thermal and Electroless deposition of copper on poly (Tetrafluoroethylene-co-hexafluoropropylene) films modified by surface graft copolymerization显示文摘	Yang G H Neoh K G	2002	Transactions on Advanced Packaging2002，25，3：	1
13	Investigation of a new lead free solder alloy using thin strip specimens显示文摘	Ren W Qian Z Lu M	1999	ASME Journal of Electronic packaging1999，121，：	1
14	Effects of Immersion zincation to the Electroless Nickel Under- Bump Materials in Microelectronics Packaging 显示文摘	Ng W C	1998	Proceedings of the Electronic Packaging Technology Conference1998，8，10：	1
15	Thermal simulation of switchgear显示文摘	Paulke J Weichert H Steinhaeuser P	2002	IEEE Transactions on Components and Packaging Technologies2002，25，3：	1
16	Reliability of board level of Pb-free Solder显示文摘	ALBRECHT H J WILKE K BRODIE D S	2003	Modern Surface Packaging2003，，4：	1
17	Effect of temperature and strain rate on mechanical properties of 63Sn/37Pb solder alloy显示文摘	Shi X Q Zhou W Pang H L J	1999	ASME:Journal of Electronic Packaging1999，121，：	1
18	Flexural Stiffness of Selected Corrugated Structures 显示文摘	LEE Myung Hoon PARK Jong Min	2004	Packag Technol Sci2004，17，：	1
19	Characterization of the Solder Paste Release from Small Stencil Apertures in theStencil Printing Process 显示文摘	SrinivasaAravamudhan DarylSantos	2005	Journal of Electronic Packaging2005，，127：	1
20	The development of Cu bond- ing wire with oxidation-resistant metal coating 显示文摘	Kaimori S Nonaka T Mizoguchi A	2006	IEEE Transaction onAdvanced Packaging2006，29，2：	1

返回顶部每页显示：

共183页首页上一页第1页下一页末页 /183 跳转

互联网出版许可证新出网证(渝)字10号全国400电话 - 免长途话费

用户提示