Interfacial microstructure and properties of diamond/Cu-xCr composites for electronic packaging applications

查看全文 作　　者：ZHANG Ximin GUO Hong YIN Fazhang FAN Yeming ZHANG [1]Yongzhong

机构地区：[1]National Engineering Research Center for Nonferrous Metals Composites,General Research Institute for Non-ferrous Metals,Beijing 100088,China

出　　处：《Rare Metals》索引2011年第30卷第1期,共5页

基　　金：supported by the High-Tech Research and Development Program of China (Nos.2006AA03A135 and 2008AA03Z505) 摘　　要：Diamond/Cu-xCr composites were fabricated by pressure infiltration process.The thermal conductivities of diamond/Cu-xCr(x = 0.1,0.5,0.8) composites were above 650 W/mK,higher than that of diamond/Cu composites.The tensile strengths ranged from 186 to 225 MPa,and the bonding strengths ranged from 400 to 525 MPa.Influences of Cr element on the thermo-physical properties and interface structures were analyzed.The intermediate layer was confirmed as Cr3C2 and the amount of Cr3C2 increased with the increase of Cr concentration in Cu-xCr alloys.When the Cr concentration was up to 0.5 wt.%,the content of the Cr3C2 layer was constant.As the thickness of the Cr3C2 layer became larger,the composites showed a lower thermal conductivity but higher mechanical properties.The coefficients of thermal expansion(CTE) of diamond/Cu-xCr(x = 0.1,0.5,0.8) composites were in good agreement with the predictions of the Kerner' model. 关键词：铜复合材料界面微结构热物理性能金刚石电子封装 CR3C2 应用复合材料制备

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Interfacial microstructure and properties of diamond/Cu-xCr composites for electronic packaging applications

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