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Effect of Bismuth on Intermetallic Compound Growth in Lead Free Solder/Cu Microelectronic Interconnect

查看全文 作　　者：T.Y. [1]Kang;Y. Y. [2]Xiu;L. [2]Hui;J.J. [2]Wang;W.P. [1]Tong;C.Z. [2]Liu 高影响力作者 机构地区：[1]Key Laboratory of Electromagnetic Processing of Materials, Ministry of Education, Northeastern University, Shenyang 110004, China;[2]Shenyang Aerospace University, Shenyang 110136, China高影响力机构 出　　处：《Journal of Materials Science & Technology》索引2011年第27卷第8期,共5页高影响力期刊 基　　金：supported by the National Natural Science Foundation of China (No. 50871026);the 111 Project(No. B07015);Foundation of National Excellent Doctoral Dissertation of China (No. 200745);Program for New Century Excellent Talents in University (No. NCET-060288);the Fundamental Research Funds for the Central Universities (No. N090109001) 摘　　要：The intermetallic compound (IMC) growth kinetics in pure Sn/Cu and Sn10 wt%Bi/Cu solder joints was studied, respectively, after they were aged at 160-210°C for different time. It was found that the total IMC in Sn10 wt%Bi/Cu joint developed faster than it did in pure Sn/Cu solder joint, when they were aged at the same temperature. And the activation energy Qa for total IMC in Sn10 wt%Bi/Cu joint was lower than that for pure Sn/Cu interconnect. The IMC growth process was discussed. The IMC Cu6Sn5 was enhanced in compensation of reduced IMC Cu3Sn growth. The work reveals that Bi element containing in lead free solder alloys with 10 wt% can enhance IMC growth in lead free solder/Cu joint during service. 关 键 词：金属间化合物 生长动力学 无铅焊锡 铜互连 微电子 IMC 生长过程 焊料合金
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