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Diffusion behavior at void tip and its contributions to void shrinkage during solid-state bonding

查看全文 作　　者：[1,2,3]C.Zhang;[1,2]M.Q.Li;[1,2]H.Li 高影响力作者 机构地区：[1]School of Materials Science and Engineering,Northwestern Polytechnical University;[2]State Key Laboratory of Solidification Processing,Northwestern Polytechnical University;[3]Department of Mechanical Engineering,University de Lyon高影响力机构 出　　处：《Journal of Materials Science & Technology》索引2018年第34卷第8期,共6页高影响力期刊 基　　金：financially supported by the National Natural Science Foundation of China (Nos.51505386 and 51275416);the Fundamental Research funds for the Central Universities (No.3102017GX06003) 摘　　要：Solid-state diffusion bonding is an advanced joining technique,which has been widely used to join similar or dissimilar materials.Generally,it is easy to observe the diffusion behavior during dissimilar bonding,but for similar bonding the diffusion behavior has yet been observed via experiments.In this study,the diffusion behavior at void tip was firstly observed during similar bonding of stainless steel.Scanning electron microscopy with energy dispersive spectroscopy was used to examine the interface characteristic and diffusion behavior.The results showed that a diffusion region was discovered at void tip.Element concentrations of diffusion region were more than those of void region,but less than those of bonded region.This behavior indicated that the diffusion was ongoing at void tip,but the perfect bond has yet formed.The diffusion region was attributed to the interface diffusion from adjacent region to void tip due to the stress gradient along bonding interface.The mass accumulation at void tip transformed the sharp void tip into smooth one at the beginning of void shrinkage,and then resulted in shorter voids. 关 键 词：Stainless steel Micro-void morphology Solid-state bonding Void tip Element diffusion
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