A transceiver frequency conversion module based on 3D micropackaging technology

查看全文 作　　者：LIU [1]Boyuan;WANG [1]Qingping;WU [1]Weiwei;YUAN [1]Naichang

机构地区：[1]School of Electronic Science and Engineering,National University of Defense Technology,Changsha 410073,China

出　　处：《Journal of Systems Engineering and Electronics》索引2020年第31卷第5期,共9页

摘　　要：The idea of Ku-band transceiver frequency conversion module design based on 3D micropackaging technology is proposed. By using the double frequency conversion technology,the dual transceiver circuit from Ku-band to L-band is realized by combining with the local oscillator and the power control circuit to complete functions such as amplification, filtering and gain. In order to achieve the performance optimization and a high level of integration of the Ku-band monolithic microwave integrated circuits(MMIC) operating chip, the 3 D vertical interconnection micro-assembly technology is used. By stacking solder balls on the printed circuit board(PCB), the technology decreases the volume of the original transceiver to a miniaturized module. The module has a good electromagnetic compatibility through special structure designs. This module has the characteristics of miniaturization, low power consumption and high density, which is suitable for popularization in practical application. 关键词：KU-BAND frequency conversion 3D packaging CHIP electromagnetic compatibility

相关文献

参考文献（35）
引证文献（4）
耦合文献（17）

参考文献(35)

引证文献(4)

耦合文献(17)

互联网出版许可证新出网证(渝)字10号全国400电话 - 免长途话费

A transceiver frequency conversion module based on 3D micropackaging technology

参考文献(35)

引证文献(4)

耦合文献(17)

用户提示