Characteristic Mode Analysis for Thin Dielectric Sheets with Alternative Surface Integral Equation

查看全文 作　　者：JIA [1]Chunlai;HE [1]Zi;DING [1]Dazhi;GUAN [2]Ling;AI [3]Xia;LIU [3]Jiaqi;CHEN [4]Xuewen 机构地区：[1]Department of Communication Engineering,Nanjing University of Science and Technology,Nanjing 210094,China;[2]Science and Technology on Electromagnetic Scattering Laboratory,Beijing Institute of Environmental Features,Beijing 100854,China;[3]National Key Laboratory of Science and Technology on Test Physics and Numerical Mathematics,Beijing 100076,China;[4]School of Physics and Wuhan National Laboratory for Optoelectronics,Huazhong University of Science and Technology,Wuhan 430074,China 出　　处：《Chinese Journal of Electronics》索引2022年第31卷第6期,共8页 基　　金：supported by the Natural Science Foundation of China(62235006,61890541,62025109,61890545,61890540,61931021)。 摘　　要：When the dielectric sheet is electrically thin in the normal direction,the conventional volume integral equation(VIE)can be approximately simplified to the surface one.On this basis,a novel surface integral equation-based formulation is presented for analyzing characteristic mode(CM)of thin dielectric sheets.The resultant CMs are expressed with tangential and normal components of electric volume currents,which are more intuitive than the conventional VIE-based one.Due to the application of volume equivalence principle,the proposed formulation is immune to non-physical modes.The CMs of typical thin dielectric bodies,including the dielectric substrate and radome,are analyzed to show that the proposed formulation is computationally efficient with encouraging accuracy. 关 键 词：Characteristic mode Thin dielectric sheet Surface integral equation Generalized eigenvalue equation