Single crystal-single crystal bonding of langasite exhibited high strength of 23.28 MPa

查看全文 作　　者：Guangyao [1]Pei;Binghe [1]Ma;Tao [1]Ye;Zhonggang [1]Zhang;Keli [1]Zhao;Jinjun [1]Deng;Seeram [2]Ramakrishna;Jian [1]Luo 机构地区：[1]Ministry of Education Key Laboratory of Micro/Nano Systems for Aerospace,Northwestern Polytechnical University,Xi’an 710072,China;[2]Centre for Nanofibers and Nanotechnology,National University of Singapore,117576,Singapore 出　　处：《Journal of Materials Science & Technology》索引2023年第29期,共9页 基　　金：the National Nat-ural Science Foundation of China(No.5207052574);the Fundamental Research Funds for the Central Universities(No.D5000220072). 摘　　要：Langasite(LGS,La_(3)Ga_(5)SiO_(14))is a promising material in high-temperature piezoelectric devices due to its excellent thermal stability,piezoelectricity,and electrical property.A major challenge in the development of LGS-based devices is to form high-strength bonding of the brittle LGS.Here,we report that the single crystal-single crystal(dual-SC)bonding of LGS is realized through thermal activation under a low com-pression of 50 kPa for the first time.A record bonding strength of 23.28 MPa is achieved within the dual-SC bonded LGS/LGS structure(with a high bonding ratio exceeding 93%),which is 5 times higher than that of the recent reported LGS/LGS bonding structure(in which a relatively fragile amorphous interface layer is formed between the two LGS samples).The smooth and void-free dual-SC bonding interface of LGS is verified via the cross-sectional transmission electron microscopy(TEM)observations. 关 键 词：Thermal activation Single crystal-single crystal bonding LANGASITE HIGH-STRENGTH Low compression