| 1 | EFFECTS OF Zn CONCENTRATION ON WETTABILITY OF Sn-Zn ALLOY ON Cu AND ON THE INTERFACIAL MICROSTRUCTURE BETWEEN Sn-Zn ALLOY AND Cu显示文摘The potential of using a hypoeutectic, instead of eutectic, Sn-Zn alloy as a lead-free solder has been discussed. The nonequilibrium melting behaviors of a series of Sn-Zn alloys were examined by differential thermal analysis. It was found that at a heating rate of 5℃ / min, Sn-6.5Zn exhibited no melting range. Dipping and spreading tests were carried out to characterize the wettability of Sn-Zn alloys on Cu. Both tests exhibited that Sn-6.5Zn has significantly better wettability on Cu than Sn-9Zn. The reaction layers formed during the spreading tests were examined. When the Zn concentration fell between 2.5wt%-9wt%, two reaction layers were formed at the interface, a thick and flat Cu5Zn8 adjacent to Cu and a thin and irregular Cu-Zn-Sn layer adjacent to the alloy. Only a Cu6Sn5 layer was formed when the Zn concentration decreased to 0.5wt%. The total thickness of the reaction layer(s) between the alloy and Cu was found to increase linearly with the Zn concentration. | H.Z. Huang X.Q. Wei L. Zhou X.D. Liu G.L. Guo | 2006 | Acta Metallurgica Sinica(English Letters)2006，19，4： | 2 |
您所在的机构暂未开通此部分的功能，请联系管理员