|
|
|
题名
|
作者
|
年代
|
出处
|
被引量
|
| 1 | Ionic contamination removal for SiO2 surfaces显示文摘 | LIN H BUSNAINA A A SUNI I I | 2002 | Surface Engineering2002,18,: | 1 |
| 2 | Removal of Al2O3 particles from SiO substrates显示文摘 | MOUMEN N BUSNAINA A | 2001 | Surface Engineering2001,17,: | 1 |
| 3 | Wall Deposition of Aerosol Particles in a Turbulent Channel Flow显示文摘 | Abuzeid S Busnaina A A and Ahmadi G | 1991 | Aerosol Science1991,22,1: | 1 |
| 4 | Particle adhesion and removal in chemical mechanical polishing and post-CMP cleaning显示文摘 | Zhang F Busnaina A A Ahmadi G | 1999 | Electrochem Soc1999,146,: | 1 |
| 5 | ROLES OF CAVITATION AND ACOUSTIC STREAMING IN MEGASONIC CLEANING显示文摘 | Glenn W. Gale Ahmed A. Busnaina | 1999 | Particulate Science and Technology1999,,3: | 1 |
| 6 | DNA-decorated carbon-nanotube-based chemical sensors on complementary metal oxidesemiconductor circuitry显示文摘 | Chia-Ling Chen Chih-Feng Yang Vinay Agarwal Taehoon Kim Sameer Sonkusale Ahmed Busnaina Michelle Chen Mehmet R Dokmeci | 2010 | Nanotechnology2010,,9: | 1 |
| 7 | Ultrasonic and megasonic theory and experimentation显示文摘 | Busnaina A A Gale G W Kashkoush I I | 1994 | Prec Cle II1994,13,4: | 1 |
| 8 | Particle adhesion and removal in chemical mechanical polishing and post-CMP cleaning 显示文摘 | ZHANG F BUSNAINA A A AHMADI G | 1999 | J of the Electrochemical Society1999,146,7: | 1 |
| 9 | Experimental and analytical study of submierometer particle removal from deep trenches 显示文摘 | BAKHTARI K GULDIKEN R O BUSNAINA A A | 2006 | Journal of the Electrochemical Society2006,153,9: | 1 |
| 10 | Material properties and machining performance of hybrid Ti_2AlN bulk material for micro electrical discharge machining显示文摘Mn+1AXn(MAX) phases are a family of nanolaminated compounds that possess unique combination of typical ceramic properties and typical metallic properties.As a member of MAX phase,Ti2 AlN bulk materials are attractive for some high-temperature applications.The synthesis,characteristics and machining performance of hybrid Ti2 AlN bulk materials were focused on in this work.The bulk samples mainly consisting of Ti2 AlN MAX phase with density close to theoretic one were synthesized by a spark plasma sintering method.Scanning electron microscopy results indicate homogenous distribution of Ti2 AlN grains in the samples.Micro-hardness values are almost constant under different loads (6-6.5 GPa).A machining test was carried out to compare the effect of material properties on micro-electrical discharge machining (micro-EDM) performance for Ti2 AlN bulk samples and Ti6242 alloy.The machining performance of the Ti2 AlN sample is better than that of the Ti6242 alloy.The inherent mechanism was discussed by considering their electrical and thermal conductivity. | Eui-Seong CHOI Jinwoo SUNG Qi-min WANG Kwang-Ho KIM Ahmed BUSNAINA Myung Chang KANG | 2012 | 中国有色金属学会会刊:英文版2012,22,S3: | 1 |
| 11 | Particle adhesion and removal mechanisms in post-CMP cleaning processes 显示文摘 | BUSNAINA A A LIN H MOUMEN N | 2002 | IEEE Trans on Semiconductor Manufacturing2002,15,4: | 1 |
| 12 | Particle adhesion and removal in chemical mechanical polishing and post-CMP cleaning显示文摘 | Zhang F Busnaina A A Ahmadi G | 1999 | J Electrochem Soc1999,146,7: | 1 |
| 13 | Submicron particle removal in post-oxide chemical-mechanical planarization ( CMP ) cleaning 显示文摘 | ZHANG F BUSNAINA A | 1999 | Applied Physics A : Materials Science and Processing1999,64,4: | 1 |
| 14 | Wall Deposition of Aerosol Particles in a Turbulent Channel Flow显示文摘 | Abuzeid S Busnaina A A Ahmadi G | 1991 | Journal of Aerosol Science1991,22,1: | 1 |
| 15 | The removal of deformed submicron particles from silicon wafers by spin rinse and megasonics 显示文摘 | Zhang F Busnaina A A Fury M A | 2000 | Journal of Electronic Materials2000,29,19: | 1 |
| 16 | Submicron particle removal in postoxide chemical-mechanical planarization (CMP) cleaning显示文摘 | Busnaina A | 1999 | Applied Physics A:Materials Science and Processing1999,64,4: | 1 |
| 17 | How to accomplish effective megasonic particle removal 显示文摘 | GALE G BUSNAINA A DAI F KASHKOUSH I | 1996 | Semiconductor International1996,19,9: | 1 |
| 18 | Submicron particle removal in post-oxide chemical-mechanical planarization (CMP) cleaning显示文摘 | Busnaina A | 1999 | Applied Physics A:Materials Science and Processing1999,64,4: | 1 |
| 19 | Targeting Arab Markets:Is Cultural Context Irrelevant to Marketing in Libya?显示文摘Marketing experts have debated for more than two decades about the effect of nationality and culture on marketing.However,most research on this issue was conducted in Western countries.An important question for marketers in the international arena,therefore,is whether the consumer’s responses(i.e.,sentiment and behavioural aspects)toward the global marketing programs in developing countries depend on culture.In a research representing a large sample of consumers and four different home appliances country-of-origin global operators in Libya,we explore the potential role of culture on consumers’responses toward foreign marketing programs.Results indicate that although the foreign companies have a tendency to adopted standardisation perspective,this does not impact on consumers’responses in a single cultural context toward marketing.The findings reveal that buying behavior was more a function of individual difference than of national cultural context.Further,our results suggest that for mainstream home appliances,segmenting on the basis of nationality is probably unnecessary and that a standardized approach would likely be successful across an increasingly relevant Arab world;and that continuing perceptions of Arab insularity are likely to be misplaced.Faced with the effectiveness of globally efficient marketing programs,local manufacturers would need to work hard to identify particular niche segments where a culturally-specific appeal might be more successful. | Izzudin Busnaina Faraj Almgatif Imen Sdiri | 2021 | Management Studies2021,9,3: | 0 |
| 20 | 纳米器件的表面预处理和成品率显示文摘近来,各种“后CMOS时代”的器件不断涌现,它们的用途广泛且发展潜力巨大。1针对这些器件的性能、表现学术界已经进行了大量的研讨,但是在器件生产制造以及提升成品率方面的研究却没有得到应有的重视。然而,如果期望在未来10年内这些器件能够由最初的研究阶段迈入发展阶段的活,相应的包括成品率提升、材料表面处理技术以及清洗技术等在内的可制造性研究会变得日益重要。 | Ahmed Busnaina | 2008 | 集成电路应用2008,25,8: | 0 |