|
|
|
题名
|
作者
|
年代
|
出处
|
被引量
|
| 1 | Effect of High Magnetic Field on Growth Behavior of Compound Layers during Reactive Diffusion between Solid Cu and Liquid Al显示文摘The effect of magnetic field on the growth behavior of compound layer was examined at the interface between the solid Cu and liquid Al during reactive diffusion. It was found that the thickness of compound layer was reduced by the high magnetic field. The growth activation energy in β, γ1 and ε2 layers under a high magnetic field was larger than those in non magnetic circumstances, the increment percentage being 4.8%, 13.3% and 5.5%, respectively. | B. Xu W.P. Tong C.Z. Liu H. zhang L. Zuo J.C. He | 2011 | Journal of Materials Science & Technology2011，27，9： | 11 |
| 2 | EFFECT OF OVERLAPPING TREATMENT ON MICROSTRUCTURE OF LASER-CLAD WC/Ni60A COMPOSITE COATING显示文摘The effect of overlapping treatment on microstructure of laser clad WC/Ni60A composite coating was studied with XRD, SEM, TEM and SAED etc. The results show that during the overlapping treatment the existence of the residual heat and edge angle effect on the substrate has changed the composition and microstructure of the coating by raising the fusion temperature and increasing the dilution degree of the coating. | C.Z. Chen 1,2) , X.D. Liu 3) , S.J. Zhang 4) , D.W. Cui 1) , T.Q. Lei 2) and J.H. Yu 1) 1) College of Material Science and Technology, Shandong University of Technology, Jinan 250061, China 2) College of Material Science and T | 1999 | Acta Metallurgica Sinica(English Letters)1999，12，5： | 6 |
| 3 | PARAMETER IDENTIFICATION IN HEMODYNAMIC MODEL OF CEREBRAL CIRCULATION显示文摘WT5”BZ]With a Hemodynamic modal of the Willis circulation, we developed a mathematical method to solve the inverse problem and obtained the values of indices in the model. Compared with the clinical data from hospital, most results agree with the clinical diagnoses. | Yao, W. Ding, G.H. Liu, H. Wang, S.Z. Lu, C.Z. Chen, S.H. | 2001 | Journal of Hydrodynamics2001，13，1： | 1 |
| 4 | Production of artemisinin by hairy root cultures of Artemisia annua L显示文摘 | C.Z. Liu Y.C. Wang F. Ouyang H.C. Ye G.F. Li | 1997 | Biotechnology Letters1997，，9： | 1 |
| 5 | 一步和两步法制备阳极氧化铝模板(英文)显示文摘手二步阳极氧化法制备了大面积上有规则排列纳米洞的阳极氧化铝模板。与一步阳极氧化法的结果进行了比较,SEM测量表明,一步阳极氧化得到的AAO模板正面(对着负电极的一面)和反面,有很大不同,正面纳米洞的分布更不规则,而二步法得到的模板正反面都有排列规则的纳米洞。这一结果也表明阳极氧化过程是一种自组织有序的过程,氧化时间越长。 | WANG C.Z. LIU X. XU C.Y. WANG L.Y. FANG Y. ZHANG P.X. | 2005 | 光散射学报2005，17，1： | 1 |
| 6 | Plant Regeneration from Mesophyll Protoplasts of Echinacea Purpurea显示文摘 | Z.G. Pan C.Z. Liu S.M.A. Zobayed P.K. Saxena | 2004 | Plant Cell Tissue and Organ Culture2004，，3： | 1 |
| 7 | Effect of Bismuth on Intermetallic Compound Growth in Lead Free Solder/Cu Microelectronic Interconnect显示文摘The intermetallic compound (IMC) growth kinetics in pure Sn/Cu and Sn10 wt%Bi/Cu solder joints was studied, respectively, after they were aged at 160-210°C for different time. It was found that the total IMC in Sn10 wt%Bi/Cu joint developed faster than it did in pure Sn/Cu solder joint, when they were aged at the same temperature. And the activation energy Qa for total IMC in Sn10 wt%Bi/Cu joint was lower than that for pure Sn/Cu interconnect. The IMC growth process was discussed. The IMC Cu6Sn5 was enhanced in compensation of reduced IMC Cu3Sn growth. The work reveals that Bi element containing in lead free solder alloys with 10 wt% can enhance IMC growth in lead free solder/Cu joint during service. | T.Y. Kang Y. Y. Xiu L. Hui J.J. Wang W.P. Tong C.Z. Liu | 2011 | Journal of Materials Science & Technology2011，27，8： | 0 |
您所在的机构暂未开通此部分的功能，请联系管理员